YAXUN YX-2015 Desoldering Wick 2.0mm

The YAXUN YX-2015 desoldering wick is an essential tool in electronics repair shops, made from precisely woven copper threads, designed to quickly and cleanly absorb excess solder from joints before reassembly. It's saturated with built-in flux that helps molten solder transfer from the joint (or excess bridge) directly onto the wick, giving you a clean result on the first try.

It offers strong resistance to oxidation and corrosion, staying effective over long periods of storage. Its 2.0mm width suits most mobile phone motherboard and BGA repair work, and its 1.5m length gives you enough material for several consecutive desoldering operations.

It's used with a heated soldering iron: place the wick over the solder area to be removed, then press it with the hot iron tip, and the copper automatically absorbs the molten solder.

Technical Specifications:

• Model: YX-2015
• Width: 2.0mm
• Length: 1.5m
• Material: Woven copper threads
• Flux: Built into the braid
• Properties: Oxidation and corrosion resistant

Common Applications:

• Removing excess solder from PCB joints.
• Cleaning BGA pads and removing solder bridges.
• Mobile phone and computer motherboard repair.
• Preparing solder areas before reassembly.