RELIFE RL-421S-OR BGA Flux Paste
18ر.س
Product description
The RELIFE RL-421S-OR flux paste is an essential material for any workshop doing BGA rework and mobile phone or computer motherboard repair. Made from high-quality imported rosin, it delivers strong activity in removing oxidation from component surfaces and pads, helping solder flow smoothly and form strong, reliable joints on the first try.
One of its standout traits is fast tinning with minimal smoke during use, keeping your workspace cleaner and safer. It offers high insulation resistance, meaning any residue left after soldering is non-conductive, eliminating the risk of short circuits on the board afterward. Its color stays pure and clear with no impurities, and it remains stable even under high heat during repeated soldering passes.
It comes in a 10cc syringe fitted with a needle and push rod, letting you dispense very precise amounts suited for work on small, delicate chips like CPU and IC reballing.
Technical Specifications:
- Type: No-clean flux paste
- Volume: 10cc
- Formula: High-quality imported rosin
- Electrical Conductivity: Insulating (non-conductive) after curing
- Packaging: Syringe with needle and push rod
- Color: Clear and pure, no impurities
Common Applications:
- BGA and CPU chip reballing.
- Soldering and desoldering SMD components.
- Mobile phone and computer motherboard repair.
- Precision soldering work requiring high thermal stability.
