YAXUN Solder Wire 0.4mm Sn63-Pb37

The YAXUN 0.4mm solder wire is a reliable choice widely used in mobile phone repair and precision electronics, offering a good balance between precision and working speed — thinner than general-purpose wires, but easier to control than ultra-fine 0.3mm wires.

Its formula is Sn63/Pb37 alloy (63% tin, 37% lead), with a melting point of 183°C — a eutectic alloy that transitions directly from liquid to solid, giving clean, stable joints on the first pass. It contains 1.2% rosin content, helping remove surface oxidation and improve adhesion without needing extra cleanup afterward.

Suited for technicians working on mobile phone motherboard repair, SMD component soldering, and precision work requiring a mid-range wire gauge.

Technical Specifications:

• Diameter: 0.4mm
• Composition: 63% Tin / 37% Lead
• Rosin (Flux) Content: 1.2%
• Melting Point: 183°C
• Weight: 43g