GELID GC-4 Syringe Heat Dissipation Silicone Thermal Plaste For CPU Processor Video GPU Cooling Grease Thermal Compound

Gelid Solutions GC-4 3.5g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive

Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission critical applications.
Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C
Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity.

Ultra-Durable &Non-Curing

Stable performance under a wide range of temperatures, ranging from-30-150°C

Ensure ultimate conductivity

GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap.filling and optimal viscosity

Ultimate Heat Conductivity

To provide the best thermal interface and to achieve ultra-efficient heat transfer from your CPU, GP and Chipset in mission critical applications