Gigabyte B860m K DDR5 | Gigabyte motherboard

Gigabyte B860m K DDR5 features | Gigabyte motherboard: supports Intel® Core™ Ultra processors (Series 2) hybrid VRM solution 4+1+2 phases D5 Bionic Corsa for infinite memory performance AI Perfdrive: provides a predefined BIOS profile ideal and customized for users EZ-Latch: PCIe x16 slot with quick release design user-friendly interface: multiple features, AIO fan control, automatic Q-Flash scan in BIOS and SW next-generation storage: 2* PCIe 4.0 x4 M.2 connectors fast networks: GbE LAN expanded connection: HDMI specifications Gigabyte B860m K DDR5 features | Gigabyte motherboard: processor LGA1851 socket: supports Intel® Core™ Ultra processors (visit GIGABYTE website for the latest CPU support list). L3 cache varies depending on the processor. memory support supports DDR5 memory modules 8800(OC) /8600(OC) /8400(OC) /8266(OC) /8200(OC) /8000(OC) /7950(OC) /7900(OC) /7800(OC) /7600(OC) /7400(OC) /7200(OC) /7000(OC) /6800(OC) /6600(OC) /6400/5600 MT/s dual DIMM slots support up to 128GB (single DIMM capacity 64GB) of system memory dual-channel memory architecture support non-buffered ECC memory modules 1Rx8/2Rx8 (non-ECC mode) support non-buffered ECC memory modules support 1Rx8/2Rx8/1Rx16 memory modules Extreme Memory Profile (XMP) support integrated graphics integrated graphics support Intel® HD graphics: one HDMI port, supports maximum resolution 4096x2160 at 60Hz* support for HDMI 2.1 and HDCP 2.3 interfaces CPU socket: one PCI Express x16 slot, supports PCIe 4.0 and x16 speed (PCIEX16)* only supports graphics card or NVMe SSD. storage interfaces chipset: two M.2 connectors (socket 3, M key, 2280 PCIe 4.0 x4/x2 supports SSD) SATA 6Gbps connectors support RAID 0, RAID 1, RAID 5, RAID 10 for SATA storage devices USB interfaces chipset: 6 USB 3.2 Gen 1 ports (4 on rear panel, 2 via internal USB connector) 2 USB 2.0/1.1 ports on rear panel chipset + USB 2.0 hub: 4 USB 2.0/1.1 ports via internal USB connectors rear panel connectors: 1 PS/2 keyboard/mouse port, 1 HDMI port, 4 USB 3.2 Gen 1 ports, 2 USB 2.0/1.1 ports, 1 RJ-45 port, 3 audio jacks component monitoring voltage detection temperature detection fan speed detection water cooling flow rate warning fan failure fan speed control main operating unit 1 × 256MB flash using AMI UEFI BIOS PnP 1.0a licensed, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 unique features support GIGABYTE Control Center (GCC)* applications available in GCC may vary depending on motherboard model. supported functions may vary according to motherboard specifications. support Q-Flash support smart backup free software LAN bandwidth management Norton® Internet Security (OEM version) operating system support for Windows 11 64-bit support for Windows 10 64-bit* Intel® NPU driver only supported on Windows 11. size compact form factor Micro ATX; 24.4 cm × 21.5 cm - redefining PCB design using artificial intelligence uses AI-supported printed circuit board technology algorithms to improve routing, guidance, and stacking. Ensures maximum performance and signal integrity across single and multiple layers throughout the design process. AI-ViaFusion technology optimized routing and pads to ensure signal safety AI-guided tracking for maximum performance AI-layer technology custom sets for enhanced functions main features: AI-generated design recipes AI-based simulation AI signal verification improvements signal on single and multiple layers AI-ViaFusion™ technology - AI-powered signal integrity excellence reduces signal reflection by up to 28.2%. AI-ViaFusion, an AI-assisted routing enhancement technology, determines optimal sizes for traces and pads in PCB areas. This technology enhances signal safety between layers and transfer efficiency, surpassing traditional design methods. best in class signal quality high transfer efficiency significant reduction in signal reflection high signal quality and reliability improvement PCB signal performance across layers AI-ViaFusion - AI-designed layout formula AI-ViaFusion is a hybrid AI-generated system across structural design. This PCB design, validated through AI simulation and testing, aims to optimize high-speed signal transfer. optimized through design various sizes for signal and power routing improved impedance matching precise control through machine learning optimized space improved planning efficiency with signal safety AI-ViaFusion technology - AI-inspired design formula AI-ViaFusion is a hybrid AI-generated system across structural design. This PCB design, validated through AI simulation and testing, aims to optimize high-speed signal transfer. optimized through design various sizes for signal and power routing improved impedance matching precise control through machine learning optimized space improved planning efficiency with signal safety AI-ViaFusion technology - AI-inspired design formula AI-ViaFusion reduces fiber weaving effects by using innovative routing angles to mitigate this effect. Benefits of mitigation: reduces signal distortion improves transmission reliability supports higher data rates enhances overall system stability AI-Layer technology - next-generation multilayer design creates innovative layer materials for multi-layer PCBs, providing unmatched performance. core innovation: custom layer design optimized with AI AI layer design