MECHANIC Solder Paste XG-50 183C 35g
18ر.س
Product description
The MECHANIC XG-50 is different from a regular flux paste — it's a full solder paste containing real solder powder mixed with flux, not just a soldering aid. It's mainly used for BGA chip reballing with stencils, SMD soldering, and any job that requires actual solder material instead of traditional solder wire.
Its formula is Sn63/Pb37 alloy (63% tin, 37% lead), a eutectic alloy that transitions directly from liquid to solid without a mushy in-between phase, giving cleaner, more precise soldering results. The particle size is very fine (25-45 microns), allowing smooth, even application that reduces solder balling and bridging between pads.
With a melting point of 183°C, it's well suited for work requiring high precision and stable heating. It comes in a 35g container, appropriate for repeated use in a workshop without waste.
Technical Specifications:
- Type: Solder paste (contains real solder)
- Alloy: Sn63/Pb37 (leaded)
- Melting Point: 183°C
- Particle Size: 25-45 microns
- Weight: 35g
- Storage: Best kept refrigerated when not in use
Common Applications:
- BGA chip reballing using stencils.
- SMD component soldering in reflow ovens or hot air stations.
- Mobile phone and computer chip repair.
- Precision PCB soldering in professional workshops.
